Electronics today are becoming more and more powerful and denser. Therefore more heat needs to be transported away from components often using conduction through the circuit board towards the heatsink or cold plate. As a thermal circuit specialist, we already offer many different technologies and materials, like aluminum and copper metal core PCB (IMS), thermal vias and ceramic PCB in aluminum oxide and Aluminum nitride.
Metal PCB or IMS are today still at our core capabilities and we have now developed the technology to take the performance to the next level by making pedestal PCB. In this case, the biggest thermal bottleneck of a metal core, the dielectric layer between the core metal and the copper circuit is bypassed by a pedestal that makes a direct connection between the (electrically isolated) thermal pad of a component.
Thanks to this bypass, the heat can be transported with less thermal resistance, keeping the temperature of the component under control and extending its lifetime and operating performance. Building pedestals will be more reliable compared to thermal vias and ensure a better spreading of the heat which allows for a better transfer to the heatsink.
Thanks to our own dedicated metal core lines, DK thermal has everything in-house to manufacture pedestal PCB reliably and in both high and as well low volumes.
Please contact us below for more information on this solution or if you would like to find out if we can help you with your thermal challenge.